March 11, 2022

Schlieren, Switzerland, March, 2022. At Photonics West 2022 (San Francisco, CA), EXALOS, the world’s leading developer of visible Superluminescent Light Emitting Diodes (SLEDs) introduced what the company believes is the smallest RGB micro-module with laser diodes (LDs) or SLEDs. These modules will enable the development of augmented and mixed reality (AR/MR) smart glasses designs based upon displays using laser beam scanning (LBS) architectures.
The RGB micro-modules can accommodate three LD chips, or a hybrid design of LD and SLED chips, in an ultra-compact package with a footprint of 4.40 mm x 4.15 mm and a height of 2.9 mm, with a total volume of only 0.053 cm3 and weight of less than 0.3 g. The semiconductor light sources are integrated on a free-space, micro-optical bench together with micro lenses and dichroic mirrors to deliver a collimated and coaxial RGB output. The design supports power levels of up to 10 mW/color and features EXALOS’ proprietary low-threshold LDs with total electrical power consumption of a few hundred milliwatts. The devices are designed for R&D purposes and are offered with a flex-PCB cable for electrical connectivity. The modules can be customized according to end user requirements and are fabricated through active alignment processes on EXALOS’ robotic micro-optical assembly line

Dr. Christian Velez, CEO of EXALOS, commented, “Since introducing our multi-wavelength SLED/LD 14-pin butterfly packages last year, we have seen tremendous customer interest in higher levels of integration of our semiconductor chips and customization for applications ranging from bio-analytical instrumentation to fiber optic gyroscopes to optical coherent tomography and augmented reality. These micro-modules represent our most compact design to date and are obviously focused on the emerging smart glasses market. While different customers are exploring numerous display architectures, it seems our design is well suited to direct retinal LBS scanning systems, where the optical power requirements are only a few milliwatts and the light source engine needs to be integrated into the temple or frame of the glasses. We are currently working on the next level of customization with hermetically-sealed packaging and higher output power levels.”
The RGB micro-modules are now available in non-hermetically sealed packages according to specific customer requirements for test and evaluation purposes. A second generation with a surface-mountable design (SMD) is under development, which would allow for high-volume manufacturing and assembly directly on PCBs. Further, it will incorporate the capability for high frequency modulation of the individual RGB chips and feature hermetic packaging for high reliability and stability.

Asia

Huang Huang
Asia Sales Manager
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